Teledyne FLIR BOSON 320 x 256 4.5mm 50° HFoV - Short Lens - LWIR Thermal Camera Core
Teledyne FLIR BOSON 320 x 256 4.5mm 50° HFoV - Short Lens - LWIR Thermal Camera Core - Image 2
Teledyne FLIR BOSON 320 x 256 4.5mm 50° HFoV - Short Lens - LWIR Thermal Camera Core - Image 3
Teledyne FLIR BOSON 320 x 256 4.5mm 50° HFoV - Short Lens - LWIR Thermal Camera Core - Image 4

Teledyne FLIR BOSON 320 x 256 4.5mm 50° HFoV – Short Lens – LWIR Thermal Camera Core

Price range: $2,020.00 through $3,029.00
We usually have a majority of these items in stock. Please call or contact us for availability.

  • Short Lens Version
  • Resolution: 320×256 – 50° HFoV
  • 4.5mm Focal Length
  • 12 µm pixel pitch VOx microbolometer
  • 21 x 21 x 11 mm camera body
  • Weight as low as 7.5 grams
  • Low power consumption, starting at 500 mW
  • Rugged construction and highest temperature rating -40 °C to +80 °C

 

Boson Consumer Grade <60mK NEDT SKU:20320AS50-6CAAX – $2020.00
Boson Professional Grade <50mK NEDT SKU:20320AS50-6PAAX – $2525.00
Boson Industrial Grade <40mK NEDT SKU:20320AS50-6IAAX – $3029.00  

Interfaces and Accessories sold separately.

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Quantity5 +
Price$1,919.00 - $2,877.55
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We usually have a majority of these items in stock.
Please call or contact us for availability.

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    FLIR Boson® 320 – 4.3mm Lens

    Compact LWIR Thermal Camera

    The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.

    With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.

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    DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE

    A full-featured VGA thermal camera module at less than 4.9 cm3.

    • 21 x 21 x 11 mm camera body and weight as low as 7.5g.
    • Low power consumption, starting at 500 mW
    • 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
    • Rugged construction and highest temperature rating -40 °C to 80 °C.
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    POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE

    FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

    • Includes embedded algorithms for noise filters, gain control, blending, and more.
    • Software-customizable functionality for video processing and power dissipation requirements.
    • Built-in support for physical and protocol-level interface standards.
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    WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET

    Unprecedented integration flexibility for fast, affordable developments.

    • Customized applications through FLIR-trusted third party developers.
    • Mechanical/electrical compatibility across all versions.
    • Variety of hardware and image processing integration to fit OEM requirements.
    Resolution ℹ️

    Pixel Pitch ℹ️

    Spectral Band ℹ️

    Noise Level (NEdT Value) ℹ️

    Boson Consumer Grade <60 mK NEdT, Boson Professional Grade <50 mK NEdT, Boson Industrial Grade <40 mK NEdT
    Frame Rate Option ℹ️

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    Shutter ℹ️

    Solar protection

    Continuous Digital Zoom

    Symbology

    Radiometry

    Scene Dynamic Range

    Temperature Accuracy

    Field of View ℹ️

    Focal Length ℹ️

    Short Lens

    f-number ℹ️

    Dimensions (L x W x H)

    Weight

    Precision Mounting Holes

    Input Voltage

    Power Dissipation

    Video Channels

    Control Channels

    Configurable GPIO

    Up to 11; user configurable
    Operating Temperature Range

    Non-Op. Temp. Range

    Shock

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    Operational Altitude

    Boson Enclosure Compatible

    IDD CAD Data Boson 320SL - 4.5mm-f1.1

    This IDD CAD Data package includes a comprehensive set of design resources, featuring a .STEP file and an accompanying PDF. The .STEP file provides a detailed 3D model that ensures compatibility with various CAD software, facilitating seamless integration into your projects. The PDF offers essential documentation, including specifications, dimensions, and guidelines to help you make the most of the provided CAD data. Download the zip file to access these valuable resources for your design and engineering needs.

     

    Download

    Teledyne FLIR Boson Family Brochure

    Download

    Teledyne FLIR Boson Datasheet

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