boson mipi

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  • Teledyne FLIR Hadron 640R High Performance, Dual Thermal and Visible OEM Camera Module

    Teledyne FLIR Hadron 640R High Performance, Dual Thermal and Visible OEM Camera Module

    Price range: $3,992.00 through $4,330.00
    • IP54 rated
    • 50mm x 36mm x 43mm (depth)
    • 56 grams
    • 2.9W max power, 1.8W typical power

     

    IR Thermal Camera:

    • Radiometric 640 x 512 Boson
    • 13.6mm
    • 32° HFOV
    • MIPI (2-lanes)
    • MIPI, I2C

    EO Visible Camera:

    • 64 MP Sensor
    • 67° HFOV
    • MIPI (4-lanes),
    • MIPI, I2C input
    • Configurable to low-light applications

     

    Hadron 640R     <40mK NEDT  SKU:70640AS32–6PMRXX – $3992.00
    Hadron+ 640R   <20mK NEDT  SKU:70640AS32–6PARXP – $4330.00
    Hadron+ 640      <20mK NEDT  SKU:70640AS32–6PAAXP – $4227.00

    Hadron Development Kits are now available. 

    Select optionsDone This product has multiple variants. The options may be chosen on the product page
  • Teledyne FLIR Boson MIPI Development Accessory Board

    Teledyne FLIR Boson MIPI Development Accessory Board

    $407.00

    Boson MIPI development board provides the option of a digital data protocol typical of a MIPI CSI v1.1, and DPHY 1.0 camera in a software configurable single or dual lane configuration.

    • Pixel Formats:
      • RAW8 (monochrome, post-AGC)
      • 16-bit UYVY (color, post-AGC)
      • RAW14 (pre-AGC)
    • Single Channel Mode:
      • Monochrome 8-bit
      • Monochrome 14-bit
      • Post-AGC 8-bit monochrome
      • Post-AGC 16-bit color YUV422 (UYVY)
    • Dual Channel Mode:
      • Monochrome 8-bit & Monochrome 14-bit
      • Post-AGC 16-bit color YUV422(UYVY) & Monochrome 8-bit
      • Post-AGC 16-bit color YUV422(UYVY) & Monochrome 14-bit
    • MIPI DDR clock rate: 246 MHz
    • Latency: <4.8ms

    NOTE: This test board is available for development purposes to fan out several of the interfaces provided on the primary I/O connector. 
    It is not intended to be integrated into final end-use products.
    Design and fabrication of an additional interface board is recommended for non-development use cases.  

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