Discontinued: Teledyne FLIR BOSON 640 x 512 73mm 6° HFoV – LWIR Thermal Camera Core
We usually have a majority of these items in stock. Please call or contact us for availability.
This product has been Discontinued.
We recommend the Teledyne FLIR Boson 55mm as the best alternative, offering similar features and performance.
- Resolution: 640×512 – 5.5° HFoV
- 12 µm pixel pitch VOx microbolometer
- 21 x 21 x 11 mm camera body
- Weight as low as 7.5 grams
- Low power consumption, starting at 500 mW
- Rugged construction and highest temperature rating -40 °C to +80 °C
Boson Consumer Grade <60mK NEDT SKU:20640A006-6CAAX – $5716.00
Boson Professional Grade <50mK NEDT SKU:20640A006-6PAAX – $6952.00
Boson Industrial Grade <40mK NEDT SKU:20640A006-6IAAX – $8188.00
Interfaces and Accessories sold separately.
We usually have a majority of these items in stock.
Please call or contact us for availability.
Discontinued: FLIR Boson – 73mm Lens
Compact LWIR Thermal Camera
The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.
With a weight as low as 7.5g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU.
DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE
A full-featured VGA thermal camera module at less than 4.9cm3.
- 21 x 21 x 11 mm camera body and weight as low as 7.5g.
- Low power consumption, starting at 500 mW
- 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.
- Rugged construction and highest temperature rating -40 °C to 80 °C.
POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE
FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.
- Includes embedded algorithms for noise filters, gain control, blending, and more.
- Software-customizable functionality for video processing and power dissipation requirements.
- Built-in support for physical and protocol-level interface standards.
WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET
Unprecedented integration flexibility for fast, affordable developments.
- Customized applications through FLIR-trusted third party developers.
- Mechanical/electrical compatibility across all versions.
- Variety of hardware and image processing integration to fit OEM requirements.
| Resolution | |
|---|---|
| Pixel Pitch | |
| Spectral Band | |
| Noise Level (NEdT Value) |
Boson Consumer Grade <60 mK NEdT, Boson Professional Grade <50 mK NEdT, Boson Industrial Grade <40 mK NEdT |
| Frame Rate Option |
<9 Hz Slow Frame Rate, 60Hz default; 30 Hz runtime selectable |
| Shutter | |
| Solar protection | |
| Continuous Digital Zoom | |
| Symbology |
Re-writable each frame; alpha blending for translucent overlay |
| Radiometry | |
| Scene Dynamic Range | |
| Temperature Accuracy | |
| Field of View | |
| Focal Length | |
| Short Lens | |
| f-number | |
| Dimensions (L x W x H) | |
| Weight | |
| Precision Mounting Holes |
Four tapped M1.6 x 0.35 (rear cover). Lens support recommended when lens mass exceeds core mass. |
| Input Voltage | |
| Power Dissipation |
Varies by configuration. 320+ as low as 500 mW, 640+ as low as 1000 mW |
| Video Channels | |
| Control Channels | |
| Configurable GPIO |
Up to 11; user configurable |
| Operating Temperature Range | |
| Non-Op. Temp. Range | |
| Shock | |
| Operational Altitude |
12 km (max altitude of a commercial airliner or airborne platform) |
| Boson Enclosure Compatible |